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Quick Turn Printed Circuit Board Assembly / Rigid PCB board Assembly

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Quick Turn Printed Circuit Board Assembly / Rigid PCB board Assembly

Good Quality Quick Turn Printed Circuit Board Assembly / Rigid PCB board Assembly Sales

Large Image :  Quick Turn Printed Circuit Board Assembly / Rigid PCB board Assembly

Huaswin Electronics Co.,Limited

Verified Supplier

China

Business type: Manufacturer, Exporter

Telephone : 86-0755-2907-7956

28D, Block D, Jin Gang Hua Ting, Xi Xiang, Bao An, Shen Zhen, China

Product Details:

Place of Origin: China
Brand Name: HUASWIN
Certification: ISO/UL/RoHS
Model Number: HSPCBA1069

Payment & Shipping Terms:

Minimum Order Quantity: 1 sets
Price: Negotiation
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Delivery Time: 15-20 working days
Payment Terms: T/T, Western Union, L/C
Supply Ability: 10,000pcs per month
Detailed Product Description

Quick Turn Rigid PCB board Assembly / Printed Circuit Board Assembly

 

 

Specifications
 

 1. PCB Assembly on SMT and DIP

 2. PCB schematic drawing/ layout /producing

 3. PCBA clone/change board

 4. Components sourcing and purchasing for PCBA 

 5. Enclosure design and plastic injection molding

 6. Testing services. Including: AOI, Fuction Testing , In Circuit Testing,  X-Ray For BGA Testing,         3D Paste Thickness Test

 7. IC programing

 

 

Quotation Requirement :

 
Following specifications are needed for quotation:
1) Base material:
2) Board thickness:
3) Copper thickness:
4) Surface treatment:
5) Color of solder mask and silkscreen:
6) Quantity
7) Gerber file &BOM
 
 

Huaswin specialized in PCB manufacturing and and PCB Assembly

 

PCBA capabilities: 

Fast prototyping
High mix, low and medium volume build
SMT MinChip:0201
BGA: 1.0 to 3.0 mm pitch
Through-hole assembly
Special processes (such as conformal coating and potting)
ROHS capability
IPC-A-610E and IPC/EIA-STD workmanship operation

 

 

Detailed Specification of PCB Manufacturing
 

1

layer

1-30 layer

2

Material

CEM-1, CEM-3 FR-4, FR-4 High TG, 
Polyimide, 
Aluminum-based
 material. 

3

Board thickness

0.2mm-6mm

4

Max.finished board size

800*508mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spacing

0.075mm(3mil)

8

Surface finish

HAL, HAL Lead free,Immersion Gold/ 
Silver/Tin,
 Hard Gold, OSP

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,TS16949

15

Profiling punching

Routing,V-CUT,Beveling

 
PCB Assembly services: 
 
SMT Assembly 


Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 
 
Through-hole Assembly 


Wave Soldering 
Hand Assembly and Soldering 
Material Sourcing 
IC pre-programming / Burning on-line 
Function testing as requested 
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design
 
 
Conformal coating


Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is 
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to 
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
 When coated, it is clearly visible as a clear and shiny material.


Complete box build


Complete 'Box Build' solutions including materials management of all components, electromechanical parts, 
plastics, casings and print & packaging material
 

 

Testing Methods


AOI Testing
Checks for solder paste 
Checks for components down to 0201" 
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of: 
BGAs 
Bare boards 


In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 
component problems. 

Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing

 

 

Quality Processes: 


1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process 
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949

 

Quick Turn Printed Circuit Board Assembly / Rigid PCB board Assembly

Contact Details
China IC Chips Online Marketplace

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